職位描述
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Summary:
1. New package technology development
2. Path-finding for new package related process flow
3. Lead new package material study and qualification.
RESPONSIBILITIES:
1. Lead a team to develop new package technology and related process flow.
2. Survey new material to make package more reliable, more robust and competitive.
3. Work with assembly house and material vendor to develop and qualify the new materials and new package.
4. Coordinates the qualification of new materials, package, assembly processes, and drive the evaluation for supplier current process and material change.
5. Qualify new supplier and develop current supplier capability and manage supplier relationship.
6. Sum up the experience of Package process, SMT process and maintain/update the assembly baseline.
7. Perform other tasks assigned by supervisor.
REQUIREMENTS:
1. Intensive hands-on experience on package technology and process development.
2. Be proficient in different processes of package, such as wafer grinding, wafer saw, die attach, flip chip die attach, plasma clean, wire bond, molding process, laser ablation, laser marking process, and etc.
3. Bachelor/master’s degree with 10 years directly related experience, or Doctor degree with 5 related experience.
4. Sufficient knowledge about semiconductor supply chain, be familiar with assembly sub-con, package BOM vendor.
5. Fluent oral and written English is required.
6. Have machine maintenance knowledge is a plus.
7. Work proactively.
工作地點
地址:成都郫都區成都成都市高新西區綜合保稅區科新路8號附3號
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詳細位置,可以參考上方地址信息
求職提示:用人單位發布虛假招聘信息,或以任何名義向求職者收取財物(如體檢費、置裝費、押金、服裝費、培訓費、身份證、畢業證等),均涉嫌違法,請求職者務必提高警惕。
職位發布者
孫莉君/..HR
成都芯源系統有限公司
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電子技術·半導體·集成電路
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1000人以上
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公司性質未知
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高新區綜合保稅區科新路8號

應屆畢業生
本科
最近更新
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注:聯系我時,請說是在江蘇人才網上看到的。
